Thermal Pads, Suitable for TO-247, Adhesive Wax, Silicone Free
Dp60-Series is a highly thermally conducting and electrically insulating, silicone free material. The Kapton® MT polyimide film as a heat conducting and electrically insulating substrate carrier coated phase-change coumpound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. Although thermal conductivity value looks as lower, the final thermal resistance is excelent. Material is suitable for thermally demanding applications.
Grundlegende Informationen:
Herstellerkennzeichnung | L05-K1.5-F21x24mm |
Spezifikationen: | Soft |
Konstruktion: | Full |
Form: | 21x24 TO247 |
Gehäuse [inch] : | I+TO247 full |
Art des Materials: | Insulating |
Material: Gehäuse | Kapton+Wax (Phase Ch |
Farbe | OG-orange |
RoHS | Ja |
REACH | Nein |
Verpackung und Gewicht:
Einheit: | Stück |
Gewicht: | 0.070002 [g] |
Verpackungstyp: | BOX |
Kleinpackung (Anzahl der Einheiten): | 100 |
Elektrophysikalische Parameter:
Uisol (@25°C/1min/50Hz) | 6000 [V] |
Thermische und mechanische Parameter:
Tmin (minimale Arbeitstemperatur) | -60 [°C] |
Tmax (maximale Arbeitstemperatur) | 140 [°C] |
Thermal conductivity | 0.46 W/m*K |
Rth Thermal Impedance | 0.147 K-in2/W |
Rth shape | 0.188 K/W |
L - Länge | 24 [mm] |
W - Breite | 21 [mm] |
T - Dicke | 0.063 [mm] |
Alternativen und Ersätze
Alternative 1: | 178733 - I+TO247-K21x24-KG38 (AAV) |
Alternative Produkte 1: | TPC-S050-KA |
Alternative Produkte 2: | KU-KG38 |
Alternative Produkte 3: | KU-KG38-0H-ST-6-624/0-L |