Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.
Grundlegende Informationen:
Herstellerkennzeichnung | 100EG-11F |
Art der Komponente: | Fillers |
Konfiguration: | Plain |
Spezifikationen: | Soft |
Gehäuse [inch] : | I+W300x200 |
Art des Materials: | Insulating |
Material: Gehäuse | Sarcon EGR |
Farbe | GY - grau 40 % |
RoHS | Ja |
REACH | Nein |
NOVINKA | N |
Verpackung und Gewicht:
Einheit: | Stück |
Gewicht: | 200 [g] |
Verpackungstyp: | BOX |
Kleinpackung (Anzahl der Einheiten): | 18 |
Elektrophysikalische Parameter:
Uisol (@25°C/1min/50Hz) | 500 [V] |
Thermische und mechanische Parameter:
Tmin (minimale Arbeitstemperatur) | -30 [°C] |
Tmax (maximale Arbeitstemperatur) | 120 [°C] |
Thermal conductivity | 1 W/m*K |
Rth Thermal Impedance | 1.36 K-in2/W |
L - Länge | 300 [mm] |
W - Breite | 200 [mm] |
T - Dicke | 1 [mm] |
Alternativen und Ersätze
Alternative Produkte 1: | I+W300x200-100GR-C &FP |